Microelectronics Packaging Fundamentals. R. R. Tummala
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Author: R. R. Tummala
Number of Pages: 864 pages
Published Date: 01 Jan 2002
Publisher: Chapman and Hall
Publication Country: London, United Kingdom
Language: English
ISBN: 9780412149016
File size: 37 Mb
File Name: Microelectronics.Packaging.Fundamentals.pdf
Download Link: Microelectronics Packaging Fundamentals
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This is an introductory level book on the fundamentals of microelectronics packaging geared toward students, technicians, and electrical and electronic engineers who need a solid reference on the basics of microelectronics packaging and design. Culled from 12 chapters in the 3-volume Microelectronics Packaging Handbook, Third Edition, it is appropriate both as a reference for those already engaged in packaging design, first and second level packages and their interconnections, test, assembly, thermal management, optoelectronics, reliability, and manufacturing.
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